DocumentCode
1427853
Title
An automated approach on electrical technology characterization and analysis
Author
Perell, C. ; Lozano, M. ; Millán, J. ; Tamayo, E. Lora
Author_Institution
CSIC, Barcelona, Spain
Volume
9
Issue
4
fYear
1996
fDate
11/1/1996 12:00:00 AM
Firstpage
573
Lastpage
577
Abstract
An automated electrical characterization environment has been implemented. The automated approach covers electrical test structure design, measurement, parameter extraction, and parameter statistical analysis. The structure design generator relies on symbolic process description and hierarchic design organization to overcome technology changes. When the technology monitors are generated, position information is given to the characterization environment. The parameters that characterize a technology are extracted using the test structure library, that also includes an SPICE level 3 extractor usable on cartographic measurements directly on-wafer. The system permits the implementation of an extraction strategy, thus identifying the technology drawbacks and saving extraction time. Extracted data sets are properly saved to allow a final statistical analysis in order to identify data limits, wafer homogeneity, parameter correlation, and correlation factors, assuming a central moment distribution
Keywords
SPICE; automatic testing; correlation methods; integrated circuit manufacture; parameter estimation; production testing; statistical analysis; SPICE level 3 extractor; automated characterization environment; cartographic measurements; central moment distribution; data limits; electrical technology characterization; electrical test structure design; extraction strategy; extraction time; final statistical analysis; hierarchic design organization; parameter correlation; parameter extraction; parameter statistical analysis; structure design generator; symbolic process description; wafer homogeneity; Assembly; Automatic testing; Character generation; Data analysis; Data mining; Electric variables measurement; Libraries; Optical feedback; Parameter extraction; Silicon;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/66.542172
Filename
542172
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