DocumentCode :
1428559
Title :
A concept for microsystems electronics
Author :
Bender, B. G.
Author_Institution :
Semiconductor Division, Hughes Aircraft Company, Newport Beach, Calif.
Volume :
80
Issue :
7
fYear :
1961
fDate :
7/1/1961 12:00:00 AM
Firstpage :
500
Lastpage :
502
Abstract :
In microsystem design, size and weight reduction are not the sole considerations. Also important are strength, reliability, design flexibility, heat drain, and costs. Means for automatic insertion of devices and simplicity of interconnection should be provided. All these influences are illustrated in the discussion of the assembly of Microseal diodes and transistors, and small passive components, first into circuit cards, then into a subsystem.
Keywords :
Assembly; Dairy products; Heating; Printed circuits; Reliability; Semiconductor diodes; Transistors;
fLanguage :
English
Journal_Title :
Electrical Engineering
Publisher :
ieee
ISSN :
0095-9197
Type :
jour
DOI :
10.1109/EE.1961.6433333
Filename :
6433333
Link To Document :
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