• DocumentCode
    1428559
  • Title

    A concept for microsystems electronics

  • Author

    Bender, B. G.

  • Author_Institution
    Semiconductor Division, Hughes Aircraft Company, Newport Beach, Calif.
  • Volume
    80
  • Issue
    7
  • fYear
    1961
  • fDate
    7/1/1961 12:00:00 AM
  • Firstpage
    500
  • Lastpage
    502
  • Abstract
    In microsystem design, size and weight reduction are not the sole considerations. Also important are strength, reliability, design flexibility, heat drain, and costs. Means for automatic insertion of devices and simplicity of interconnection should be provided. All these influences are illustrated in the discussion of the assembly of Microseal diodes and transistors, and small passive components, first into circuit cards, then into a subsystem.
  • Keywords
    Assembly; Dairy products; Heating; Printed circuits; Reliability; Semiconductor diodes; Transistors;
  • fLanguage
    English
  • Journal_Title
    Electrical Engineering
  • Publisher
    ieee
  • ISSN
    0095-9197
  • Type

    jour

  • DOI
    10.1109/EE.1961.6433333
  • Filename
    6433333