DocumentCode
1428559
Title
A concept for microsystems electronics
Author
Bender, B. G.
Author_Institution
Semiconductor Division, Hughes Aircraft Company, Newport Beach, Calif.
Volume
80
Issue
7
fYear
1961
fDate
7/1/1961 12:00:00 AM
Firstpage
500
Lastpage
502
Abstract
In microsystem design, size and weight reduction are not the sole considerations. Also important are strength, reliability, design flexibility, heat drain, and costs. Means for automatic insertion of devices and simplicity of interconnection should be provided. All these influences are illustrated in the discussion of the assembly of Microseal diodes and transistors, and small passive components, first into circuit cards, then into a subsystem.
Keywords
Assembly; Dairy products; Heating; Printed circuits; Reliability; Semiconductor diodes; Transistors;
fLanguage
English
Journal_Title
Electrical Engineering
Publisher
ieee
ISSN
0095-9197
Type
jour
DOI
10.1109/EE.1961.6433333
Filename
6433333
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