DocumentCode :
1430385
Title :
Packaging of PIN Photodiode on Patch Antenna for a Dual-Mode Indoor RF/FSO Receiver
Author :
Liao, Jun ; Mirvakili, Ali ; Boryssenko, Anatoliy O. ; Joyner, Valencia M. ; Huang, Zhaoran Rena
Author_Institution :
Dept. of Electr., Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
Volume :
1
Issue :
3
fYear :
2011
fDate :
3/1/2011 12:00:00 AM
Firstpage :
335
Lastpage :
343
Abstract :
This paper reports the design, packaging and characterization of a miniaturized dual-mode radio-frequency (RF)/free space optical (FSO) indoor wireless receiver module. Two different patch antennas are designed and integrated with bare die photodiodes together with transimpedance amplifier (TIA) circuits on a printed circuit board (PCB). Ansoft HFSS is used to predict the coupling from RF to FSO link. Measurement results verify that optical link degradation is minimized with the specially designed patch structure. FSO link operation at 2 Gb/s in a 10 GHz RF environment is achieved. Through the comparison to previously developed RF/FSO modules, the new receiver boards demonstrate reduced RF-to-optical cross channel coupling, and increased gain and antenna radiation efficiency.
Keywords :
antenna radiation patterns; microstrip antennas; microwave antennas; operational amplifiers; optical links; p-i-n photodiodes; packaging; printed circuits; radio receivers; Ansoft HFSS; FSO link; PIN photodiode packaging; RF coupling; RF-to-optical cross channel coupling; antenna radiation; bit rate 2 Gbit/s; dual-mode radio-frequency-free space optical indoor wireless receiver module; frequency 10 GHz; optical link degradation; patch antenna; printed circuit board; transimpedance amplifier circuit; Antenna measurements; Antenna radiation patterns; Bonding; Patch antennas; Radio frequency; Substrates; Dual mode wireless communication; free space optics; hybrid packaging; patch antenna;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2010.2101730
Filename :
5692868
Link To Document :
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