• DocumentCode
    1431604
  • Title

    Suppression of leakage resonance in coplanar MMIC packages using a Si sub-mount layer

  • Author

    Kim, Sung-Jin ; Ho-Sung Yeon ; Lee, Hai-Young

  • Author_Institution
    Dept. of Electron. Eng., Ajou Univ., Suwon, South Korea
  • Volume
    48
  • Issue
    12
  • fYear
    2000
  • fDate
    12/1/2000 12:00:00 AM
  • Firstpage
    2664
  • Lastpage
    2669
  • Abstract
    In this paper, we examined the parasitic leakage resonance of coplanar monolithic microwave and millimeter-wave integrated circuits (MMICs) by the finite-difference time-domain calculations and experiments. The results show that leakages from coplanar MMICs become significantly resonant in finite substrates and packaging enclosures. In order to avoid the leakage resonance, a resonance suppression method using a doped-Si sub-mount layer is proposed and experimented in a frequency range from 0.5 to 40 GHz. The resonance suppression scheme is verified by measuring the S-parameters of the fabricated conductor-backed coplanar waveguides having an Si sub-mount layer of different resistivities (1 mΩ·cm, 15 Ω·cm, and 4 kΩ·cm). The leakage resonance can be completely suppressed using the typical 15 Ω·cm Si sub-mount layer
  • Keywords
    MMIC; S-parameters; coplanar waveguides; finite difference time-domain analysis; integrated circuit packaging; leakage currents; resonance; silicon; substrates; 0.5 to 40 GHz; 1 mohmcm; 15 ohmcm; 4 kohmcm; FDTD calculations; S-parameters; Si sub-mount layer; conductor-backed CPW; conductor-backed coplanar waveguides; coplanar MMIC packages; doped-Si layer; finite substrates; finite-difference time-domain calculations; leakage resonance suppression; packaging enclosures; parasitic leakage resonance; Conductivity; Coplanar waveguides; Finite difference methods; Frequency; Integrated circuit packaging; MMICs; Millimeter wave integrated circuits; Resonance; Scattering parameters; Time domain analysis;
  • fLanguage
    English
  • Journal_Title
    Microwave Theory and Techniques, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9480
  • Type

    jour

  • DOI
    10.1109/22.899028
  • Filename
    899028