• DocumentCode
    1431630
  • Title

    Highly Uniform Bipolar Resistive Switching With  \\hbox {Al}_{2}\\hbox {O}_{3} Buffer Layer in Robust NbAlO-Based RRAM

  • Author

    Chen, Lin ; Xu, Yan ; Sun, Qing-Qing ; Liu, Han ; Gu, Jing-Jing ; Ding, Shi-Jin ; Zhang, David Wei

  • Author_Institution
    Dept. of Microelectron., Fudan Univ., Shanghai, China
  • Volume
    31
  • Issue
    4
  • fYear
    2010
  • fDate
    4/1/2010 12:00:00 AM
  • Firstpage
    356
  • Lastpage
    358
  • Abstract
    The bipolar resistive switching characteristics of atomic-layer-deposited NbAlO-based devices have been investigated for nonvolatile memory applications. With the help of a thin Al2O3 buffer layer, highly uniform and reproducible bipolar resistance switching cycles could be observed. Four typical multilevel operations, with resistances being at 1000, 350, 145, and 75 ??, respectively, are also successfully demonstrated by varying the current compliance during the set process. The resistance ratios of high-resistance state to low-resistance state are more than 103 within 5000 cycles during the test without any degradation. Moreover, the estimated retention lifetime at room temperature is sufficiently long to fulfill the typical ten-year requirement. Considering its excellent memory switching behavior, a resistance switching device composed of a NbAlO film with a thin Al2O3 buffer layer is a possible candidate to be integrated into future memory processes.
  • Keywords
    alumina; atomic layer deposition; buffer layers; electric current; electric resistance; niobium compounds; random-access storage; thin film devices; Al2O3-NbAlO; atomic layer deposition; bipolar resistive switching; current compliance; high-resistance state; low-resistance state; memory switching behavior; multilevel operations; nonvolatile memory; resistance 75 ohm to 1000 ohm; resistance ratios; resistance switching device; resistive random access memory; robust RRAM; room temperature retention lifetime; temperature 293 K to 298 K; thin buffer layer; Atomic layer deposition; NbAlO; conductive filament; resistive switching;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2010.2041183
  • Filename
    5424053