DocumentCode
1433433
Title
Ferroelectric memory: on the brink of breaking through
Author
Derbenwick, Gary F. ; Isaacson, Alan F.
Volume
17
Issue
1
fYear
2001
fDate
1/1/2001 12:00:00 AM
Firstpage
20
Lastpage
30
Abstract
With a memory-cell size comparable to that of a DRAM memory cell and a manufacturing process similar to that of a stacked high-density DRAM, it can be expected that the ferroelectric technology will leverage off DRAMs and leap frog to higher memory densities. Cost analysis projects cost competitiveness with flash memory and EEPROM. Ferroelectric memory technology has been shown to have reliability levels comparable to or better than other reprogrammable nonvolatile semiconductor memories. High levels of radiation hardness make these memories suitable for near and deep-space applications. Many large semiconductor companies have substantial efforts to develop and introduce ferroelectric memories into the market
Keywords
cellular arrays; ferroelectric storage; integrated circuit reliability; radiation hardening (electronics); space vehicle electronics; SBT ferroelectric memory technology; cost competitiveness; deep-space applications; manufacturing process; memory densities; memory-cell size; radiation hardness; reliability levels; Capacitors; Conducting materials; Electrodes; Ferroelectric materials; MOSFETs; Nonvolatile memory; Pulse circuits; Semiconductor diodes; Silicon on insulator technology; Voltage;
fLanguage
English
Journal_Title
Circuits and Devices Magazine, IEEE
Publisher
ieee
ISSN
8755-3996
Type
jour
DOI
10.1109/101.900124
Filename
900124
Link To Document