• DocumentCode
    1433433
  • Title

    Ferroelectric memory: on the brink of breaking through

  • Author

    Derbenwick, Gary F. ; Isaacson, Alan F.

  • Volume
    17
  • Issue
    1
  • fYear
    2001
  • fDate
    1/1/2001 12:00:00 AM
  • Firstpage
    20
  • Lastpage
    30
  • Abstract
    With a memory-cell size comparable to that of a DRAM memory cell and a manufacturing process similar to that of a stacked high-density DRAM, it can be expected that the ferroelectric technology will leverage off DRAMs and leap frog to higher memory densities. Cost analysis projects cost competitiveness with flash memory and EEPROM. Ferroelectric memory technology has been shown to have reliability levels comparable to or better than other reprogrammable nonvolatile semiconductor memories. High levels of radiation hardness make these memories suitable for near and deep-space applications. Many large semiconductor companies have substantial efforts to develop and introduce ferroelectric memories into the market
  • Keywords
    cellular arrays; ferroelectric storage; integrated circuit reliability; radiation hardening (electronics); space vehicle electronics; SBT ferroelectric memory technology; cost competitiveness; deep-space applications; manufacturing process; memory densities; memory-cell size; radiation hardness; reliability levels; Capacitors; Conducting materials; Electrodes; Ferroelectric materials; MOSFETs; Nonvolatile memory; Pulse circuits; Semiconductor diodes; Silicon on insulator technology; Voltage;
  • fLanguage
    English
  • Journal_Title
    Circuits and Devices Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    8755-3996
  • Type

    jour

  • DOI
    10.1109/101.900124
  • Filename
    900124