Title :
Manufacturing process for combination lead frame/TAB BGA
Author :
Mita, Mamoru ; Murakami, Gen ; Kumakura, Toyohiko ; Kashiwabara, Fumitaka
Author_Institution :
Densen Works, Hitachi Cable Ltd., Ibaraki, Japan
fDate :
7/1/1998 12:00:00 AM
Abstract :
The combination lead frame/tape automated bonding ball grid array (TAB BGA) has been studied to improve the manufacturability of thin ball grid array (TBGA) large scale integrated (LSI) packages. Ordinary lead frames and the TAB tape carriers have been applied to make the assembly of TBGA easier. The base technologies, the materials of the lead frame, and the TAB tape were thoroughly applied to the heat spreader and the fine routing flexible substrate. The lead frames as the heat spreader and the tape (manufactured by the line of the TAB tape for wire bonding substrate) are combined with a high thermal resistive adhesive (Tg473K). As the solder balls are reflowed prior to die attach, current assembly houses will never need the ball mounter to produce the TBGA
Keywords :
adhesion; integrated circuit packaging; large scale integration; reflow soldering; tape automated bonding; LSI package; assembly; combination lead frame/TAB BGA; die attach; heat spreader; manufacturing process; solder ball reflow; tape automated bonding; tape carrier; thermal resistive adhesive; thin ball grid array; wire bonding substrate; Assembly; Bonding; Electronics packaging; Large scale integration; Lead; Manufacturing automation; Manufacturing processes; Routing; Thermal resistance; Wire;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on
DOI :
10.1109/3476.720418
