Title :
Air Cooling Technologies For Electronic Equipment [Book Reviews]
Author :
Lall, P. ; Pecht, Michael G.
Author_Institution :
Motorola
fDate :
7/1/1998 12:00:00 AM
Keywords :
Book reviews; Electronic equipment; Electronics cooling; Electronics packaging; Engine cylinders; Heat transfer; Heat treatment; Printed circuits; Regions; Thermal resistance;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on
DOI :
10.1109/TCPMC.1998.720424