• DocumentCode
    1433899
  • Title

    Direct electrostatic levitation and propulsion of silicon wafer

  • Author

    Jin, Ju ; Yih, Tachung C. ; Higuchi, Toshiro ; Jeon, Jong Up

  • Author_Institution
    ADE Corp., Charlotte, NC, USA
  • Volume
    34
  • Issue
    5
  • fYear
    1998
  • Firstpage
    975
  • Lastpage
    984
  • Abstract
    A new type of contactless wafer manipulator, featuring “direct electrostatic levitation and propulsion of silicon wafer (DELP-SW)”, has been successfully developed. The novel aspect of this manipulator is that a silicon wafer can be directly levitated and driven via electrostatic forces. In this paper, a brief review of basic principles is presented. This is followed by a description of the structure of a prototype DELP-SW mechanism, including electrode design, position feedback control method, driving principle, and the operational procedure. Experimental results, which demonstrate completely contactless transportation of an 8-in silicon wafer, are also presented
  • Keywords
    electrodes; electrostatic devices; feedback; materials handling; position control; propulsion; semiconductor device manufacture; 8 in; contactless wafer manipulator; direct electrostatic levitation; direct electrostatic propulsion; driving principle; electrode design; electrostatic forces; operational procedure; position feedback control method; silicon wafer; Electrodes; Electrostatic levitation; Glass; Industry Applications Society; Magnetic levitation; Propulsion; Semiconductor materials; Silicon; Transportation; Voltage;
  • fLanguage
    English
  • Journal_Title
    Industry Applications, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0093-9994
  • Type

    jour

  • DOI
    10.1109/28.720437
  • Filename
    720437