DocumentCode
1434670
Title
Dual-Source-Line-Bias Scheme to Improve the Read Margin and Sensing Accuracy of STTRAM in Sub-90-nm Nodes
Author
Chatterjee, Subho ; Salahuddin, Sayeef ; Mukhopadhyay, Saibal
Author_Institution
Dept. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume
57
Issue
3
fYear
2010
fDate
3/1/2010 12:00:00 AM
Firstpage
208
Lastpage
212
Abstract
This brief analyzes the circuit-induced challenges to reliability and write current scaling of spin-torque-transfer random access memory (STTRAM). We show that, at sub-90-nm nodes, increased transistor leakage increases the probability of incorrect sensing requiring a higher read current. However, a higher read current can increase the read disturb failure, particularly with a reduced write current. To satisfy the conflicting requirements of read margin and sensing accuracy, we propose a source-line biasing technique. Simulations in predictive 65-nm nodes show that the proposed solution simultaneously reduce the sensing errors and improve the read margin.
Keywords
random-access storage; reliability theory; dual source line bias scheme; read margin; reliability; sensing accuracy; sensing errors; source line biasing technique; spin torque transfer random access memory; transistor leakage; write current; Dual-source-line bias (DSLB); leakage current; magnetic tunneling junction (MTJ); read margin; spin-torque-transfer random access memory (STTRAM);
fLanguage
English
Journal_Title
Circuits and Systems II: Express Briefs, IEEE Transactions on
Publisher
ieee
ISSN
1549-7747
Type
jour
DOI
10.1109/TCSII.2010.2040308
Filename
5427114
Link To Document