Title :
Shielding-Cancelation Technique for Suppressing Common-Mode EMI in Isolated Power Converters
Author :
Lihong Xie ; Xinbo Ruan ; Qing Ji ; Zhihong Ye
Author_Institution :
Aero-Power Sci-tech Center, Nanjing Univ. of Aeronaut. & Astronaut., Nanjing, China
Abstract :
In an isolated power converter, the interwinding capacitance of the transformer is the critical coupling path for the generating of common-mode (CM) noise. The shielding technique, for the purpose of blocking the electric coupling between the adjacent windings, has been widely used to deal with the CM noise. For the transformer with a single shielding layer, the displacement current that flows between the shielding layer and its adjacent windings still causes CM noise. In this paper, the shielding-cancelation (SC) technique is proposed by combining the shielding technique and the winding cancelation method together: The shielding layer is adjusted to have the same turns number and winding direction with its adjacent windings. In this way, the dv/dt on the interwinding capacitance is always zero; thus, the CM noise can be effectively suppressed. A flyback converter prototype is built in the laboratory, and the performance of the SC technique on suppressing the CM noise is verified by experiments.
Keywords :
electromagnetic shielding; interference suppression; power convertors; transformer windings; CM noise; SC technique; common-mode EMI suppression; common-mode noise; critical coupling path; displacement current; electromagnetic interference; flyback converter; interwinding capacitance; isolated power converter; shielding technique; shielding-cancellation technique; single shielding layer; winding cancelation method; Capacitance; Electric potential; Electromagnetic interference; Noise; Rectifiers; Windings; Wires; Common mode (CM) noise; Common mode (CM) noise, isolated power converter, noise cancellation, shielding, transformer; isolated power converter; noise cancelation; noise cancellation; shielding; transformer;
Journal_Title :
Industrial Electronics, IEEE Transactions on
DOI :
10.1109/TIE.2014.2365154