DocumentCode :
1434829
Title :
Effects of ion-beam mixing on the performance and reliability of devices with self-aligned silicide structure
Author :
Ku, Y.H. ; Lee, S.K. ; Kwong, Dim-Lee ; Lee, C.O. ; Yeargain, John R.
Author_Institution :
Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
Volume :
9
Issue :
6
fYear :
1988
fDate :
6/1/1988 12:00:00 AM
Firstpage :
293
Lastpage :
295
Abstract :
The uniformity of Ti silicide resistance has been greatly improved by using an ion-beam mixing technique. The integrity of both MOS capacitors and p-n junction diodes has been improved. N-channel MOS field-effect transistors fabricated with this technique show better electrical characteristics, less electron trapping in the gate oxide, and better hot-carrier resistance than with devices made without the use of ion-beam mixing.<>
Keywords :
VLSI; capacitors; insulated gate field effect transistors; metallisation; reliability; semiconductor technology; titanium compounds; MOS capacitors; N-channel MOS field-effect transistors; TiSi/sub 2/; electrical characteristics; electron trapping; gate oxide; hot-carrier resistance; integrity; ion-beam mixing; p-n junction diodes; performance; reliability of devices; salicides; self-aligned silicide structure; silicide resistance uniformity; Annealing; CMOS technology; Diodes; Electric resistance; FETs; Hot carriers; MOS capacitors; P-n junctions; Silicides; Titanium;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.721
Filename :
721
Link To Document :
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