DocumentCode
1435091
Title
Modeling the substrate effect in interconnect line characteristics of high-speed VLSI circuits
Author
Wee, Jae-Kyung ; Park, Young-June ; Min, Hong-Shick ; Cho, Dae-Hyung ; Seung, Man-Ho ; Park, Hun-Sup
Author_Institution
Sch. of Electr. Eng., Seoul Nat. Univ., South Korea
Volume
46
Issue
10
fYear
1998
fDate
10/1/1998 12:00:00 AM
Firstpage
1436
Lastpage
1443
Abstract
A new analytic model for interconnect characteristics is proposed. The model includes the frequency-dependent distribution of the current on the interconnect lines and the substrate as the current path. The validity of the proposed model has been checked by a comparison with the measurement data and the numerical simulation. Through this work, it is found that the substrate return path must be considered for the accurate prediction of the high-frequency characteristics of interconnects
Keywords
VLSI; current distribution; integrated circuit interconnections; integrated circuit modelling; substrates; analytic model; current distribution; high frequency characteristics; high speed VLSI circuit; interconnect line; substrate effect; Analytical models; Frequency; Impedance; Inductance; Integrated circuit interconnections; Laboratories; Numerical simulation; Signal analysis; Silicon; Very large scale integration;
fLanguage
English
Journal_Title
Microwave Theory and Techniques, IEEE Transactions on
Publisher
ieee
ISSN
0018-9480
Type
jour
DOI
10.1109/22.721145
Filename
721145
Link To Document