DocumentCode :
1435159
Title :
Design and Characterization of Thin-Film System for Microsensors Embedding in Ti6Al4V Alloys
Author :
Zhang, Xugang ; Li, Xiaochun
Author_Institution :
Johnson Controls-Saft Adv. Power Solutions, Milwaukee, WI, USA
Volume :
10
Issue :
4
fYear :
2010
fDate :
4/1/2010 12:00:00 AM
Firstpage :
839
Lastpage :
846
Abstract :
Reliable structures and systems are critical for numerous engineering applications. These systems are generally operated in harsh environments. Effective monitoring and diagnosis of these structures are of critical importance. To achieve this goal, thin-film micro/nano sensors can be embedded in metal structures to protect them from external harsh environments while providing measurements with desired special and temporal resolutions and accuracy, which cannot be achieved with traditional sensors. Targeting on new sensor applications in harsh environments, this paper presents experimental results on the design and characterization of a thin-film system, including diffusion barrier and insulation layers, for a successful sensor embedding in Ti6Al4V alloy through diffusion bonding. Based on the developed material system, an effective fabrication process of the Ti6Al4V-embedded thin-film PdCr strain gages was developed. The embedded sensors were validated by a functionality test and material characterization.
Keywords :
aluminium alloys; microsensors; nanosensors; thin film sensors; titanium alloys; vanadium alloys; diffusion barrier; diffusion bonding; harsh environments; insulation layers; microsensors; thin-film micro-nano sensors; thin-film system; Diffusion bonding; Insulation; Microsensors; Monitoring; Protection; Reliability engineering; Sensor phenomena and characterization; Sensor systems and applications; Thin film sensors; Transistors; Diffusion bonding; embedded microsensors; harsh environments; thin-film strain gages;
fLanguage :
English
Journal_Title :
Sensors Journal, IEEE
Publisher :
ieee
ISSN :
1530-437X
Type :
jour
DOI :
10.1109/JSEN.2009.2035369
Filename :
5427263
Link To Document :
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