• DocumentCode
    1435310
  • Title

    Time-domain simulation of large lossy interconnect systems on conducting substrates

  • Author

    Braunisch, Henning ; Grabinski, Hartmut

  • Author_Institution
    Dept. of Electr. Eng., MIT, Cambridge, MA, USA
  • Volume
    45
  • Issue
    9
  • fYear
    1998
  • fDate
    9/1/1998 12:00:00 AM
  • Firstpage
    909
  • Lastpage
    918
  • Abstract
    The most general class of uniform transmission-line systems is considered, assuming that samples of the frequency dependent parameter matrices R, L, G, and C are given. In particular, substrate effects which influence wave propagation along integrated circuits (IC) interconnects typically over a very broad range of frequencies are included. A time-domain simulation technique which can handle this problem is described in detail. The algorithm can be embedded in general-purpose circuit simulators and is based on modal analysis, mode tracking, modal delay separation, broadband rational function least squares approximation directly in partial fraction form, and recursive convolution. A numerical example for realistic geometry and material parameters of the examined transmission line structure shows the significance of substrate effects in the frequency and-more important-in the time domain
  • Keywords
    integrated circuit interconnections; integrated circuit modelling; time-domain analysis; transmission line matrix methods; algorithm; broadband rational function least squares approximation; circuit simulator; conducting substrate; integrated circuit; lossy interconnect; modal analysis; modal delay separation; mode tracking; parameter matrix; recursive convolution; time domain simulation; transmission line; Analytical models; Approximation algorithms; Circuit simulation; Delay; Frequency dependence; Integrated circuit interconnections; Modal analysis; Time domain analysis; Transmission line matrix methods; Transmission lines;
  • fLanguage
    English
  • Journal_Title
    Circuits and Systems I: Fundamental Theory and Applications, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1057-7122
  • Type

    jour

  • DOI
    10.1109/81.721257
  • Filename
    721257