Title :
Transfer of structured and patterned thin silicon films using the Smart-Cut(R) process
Author :
Aspar, B. ; Bruel, M. ; Zussy, M. ; Cartier, A.M.
Author_Institution :
CEA, Centre d´´Etudes Nucleaires de Grenoble, France
fDate :
10/10/1996 12:00:00 AM
Abstract :
The feasibility of transferring patterned and multilayered thin films, simulating part of the stacked structure of a CMOS integrated circuit, from their original bulk silicon substrate to a final substrate, was demonstrated using the Smart-Cut process
Keywords :
CMOS integrated circuits; elemental semiconductors; integrated circuit technology; semiconductor thin films; silicon; silicon-on-insulator; thin film transistors; CMOS integrated circuit; SOI; Si; Smart-Cut process; multilayered thin films; patterned thin Si films; stacked structure; thin film transfer technique;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19961305
