• DocumentCode
    1437010
  • Title

    A New RSD Poly-Si Thin Film Transistor With Inside Spacer Design

  • Author

    Chien, Feng-Tso ; Chang, Ming-Che

  • Author_Institution
    Dept. of Electron. Eng., Feng-Chia Univ., Taichung, Taiwan
  • Volume
    57
  • Issue
    5
  • fYear
    2010
  • fDate
    5/1/2010 12:00:00 AM
  • Firstpage
    1173
  • Lastpage
    1177
  • Abstract
    In this brief, a raised source/drain, accompanied with an inside spacer poly-Si thin film transistor (RSDIS-TFT) structure, has been proposed and discussed. The gate covered on an inside spacer can serve as a field plate and create a field-induced drain region to reduce the channel electric field. The proposed device has a lower drain electric field and can alleviate the kink effect. In addition, the leakage current can also be reduced. This is because this RSDIS structure can spread the electric field intensity out at the end of the drain, and decrease the drain electric field. Moreover, the device stability, such as the threshold voltage shift and transconductance degradation under a high gate bias, is improved by the design of raised source/drain and inside spacer structure. The lower drain electric field of the RSDIS-TFT is also beneficial to scaling down the device for a better performance. Therefore, the proposed poly-Si TFT is suitable to be used in active-matrix flat panel electronics.
  • Keywords
    kink instability; thin film transistors; RSD poly-Si thin film transistor; active-matrix flat panel electronics; raised source/drain; spacer design; threshold voltage shift; transconductance degradation; Active matrix liquid crystal displays; Active matrix technology; Degradation; Electric resistance; Grain boundaries; Ion implantation; Leakage current; Stability; Thin film transistors; Threshold voltage; Transconductance; Inside spacer (IS); kink effect; raised source/drain (RSD); thin film transistor (TFT);
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2010.2043180
  • Filename
    5428834