DocumentCode
1437336
Title
p-channel LDMOS transistor using new tapered field oxidation technology
Author
Kim, Jung-Ho ; Kim, J. ; Koo, J.G. ; Kim, D.Y.
Author_Institution
Micro-Electron. Lab. Technol., Electron. & Telecommun. Res. Inst., Taejeon, South Korea
Volume
34
Issue
19
fYear
1998
fDate
9/17/1998 12:00:00 AM
Firstpage
1893
Lastpage
1894
Abstract
The on-resistance of p-channel RESURF (reduced surface field) LDMOS (lateral double-diffused MOS) transistors has been improved by using a new tapered TEOS field oxide in the drift region of the devices. With similar breakdown voltage, at Vgs=-5.0 V, the specific on-resistance of the LDMOS with tapered field oxide is ~31.5 mΩ·cm2, while that of the LDMOS with conventional field oxide is ~57 mΩ·cm2
Keywords
electric breakdown; integrated circuit technology; oxidation; power MOSFET; power integrated circuits; silicon-on-insulator; -5 V; MOS transistors; RESURF type; SOI LDMOS device; breakdown voltage; drift region; lateral double-diffused MOSFET; p-channel LDMOS transistor; reduced surface field; tapered TEOS field oxide; tapered field oxidation technology;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:19981303
Filename
722415
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