• DocumentCode
    1437387
  • Title

    Three-dimensional numerical analysis of the stability of Ag/Bi/sub 2/Sr/sub 2/Ca/sub 2/Cu/sub 3/O/sub x/ tape conductors

  • Author

    Burkhardt, E.E. ; Schwartsz, J.

  • Author_Institution
    Nat. High Magn. Field Lab., Florida State Univ., Tallahassee, FL, USA
  • Volume
    7
  • Issue
    2
  • fYear
    1997
  • fDate
    6/1/1997 12:00:00 AM
  • Firstpage
    199
  • Lastpage
    202
  • Abstract
    As the properties of high-T/sub c/ superconducting tapes improve, practical design considerations require more detailed analysis. Here we report investigations of the stability of high-T/sub c/ superconducting tapes. As a result of the broad range of temperature during a transition and the strong temperature dependence and anisotropy of the material properties, the finite element method (FEM) is used to solve the three-dimensional heat conduction equation. The heat source is determined using the operating current, the resistivity of the materials and the critical current density of Bi/sub 2/Sr/sub 2/Ca/sub 2/Cu/sub 3/O/sub x/ (BSCCO). The minimum quench energy for several sources is determined for both infinitely long and planar uniform sources in the BSCCO and the two cases are compared.
  • Keywords
    bismuth compounds; calcium compounds; finite element analysis; heat conduction; high-temperature superconductors; silver; strontium compounds; superconducting tapes; Ag-Bi/sub 2/Sr/sub 2/Ca/sub 2/Cu/sub 3/O; Ag/Bi/sub 2/Sr/sub 2/Ca/sub 2/Cu/sub 3/O/sub x/ tape conductor; BSCCO; finite element method; heat conduction; high-T/sub c/ superconductor; minimum quench energy; stability; three-dimensional numerical analysis; Anisotropic magnetoresistance; Bismuth compounds; Material properties; Numerical analysis; Numerical stability; Stability analysis; Superconducting films; Superconducting transition temperature; Temperature dependence; Temperature distribution;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/77.614465
  • Filename
    614465