DocumentCode :
1438109
Title :
Analysis of thermal instability in multi-finger power AlGaAs/GaAs HBT´s
Author :
Lu, Ke ; Snowden, Christopher M.
Author_Institution :
Dept. of Electron. & Electr. Eng., Leeds Univ., UK
Volume :
43
Issue :
11
fYear :
1996
fDate :
11/1/1996 12:00:00 AM
Firstpage :
1799
Lastpage :
1805
Abstract :
A new theory is developed in this paper to explain the collapse of current gain in multi-finger power AlGaAs/GaAs Heterojunction Bipolar Transistors (HBT´s). The reasons behind this unwanted phenomenon are fully clarified using a simple model to investigate the thermo-electrical interaction between the fingers. The existence of multi-value equilibrium points in model´s constitutive equations is shown to be the necessary condition for the collapse of current gain to appear. For a N-finger device, N different patterns of collapse exist. The criterion to select the global stable pattern is given. The method has been used to predict the collapse in AlGaAs/GaAs HBT´s and the agreement is excellent. The method also predicts that the collapse can happen far earlier than is normally expected in multi-finger high-power devices. The influence of ballasting resistance and thermal resistance is also investigated
Keywords :
III-V semiconductors; aluminium compounds; current distribution; gallium arsenide; heterojunction bipolar transistors; microwave bipolar transistors; microwave power transistors; power bipolar transistors; semiconductor device models; thermal resistance; thermal stability; AlGaAs-GaAs; ballasting resistance; collapse patterns; current gain collapse; global stable pattern selection criterion; microwave industry; microwave power modules; model; multi-finger power AlGaAs/GaAs HBT; multi-value equilibrium points; nonlinear I-V-T relationships; thermal instability; thermal resistance; thermo-electrical interaction; Current density; Equations; Fingers; Gallium arsenide; Heterojunction bipolar transistors; Microwave devices; Power amplifiers; Temperature distribution; Thermal conductivity; Thermal resistance;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.543010
Filename :
543010
Link To Document :
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