DocumentCode
1438433
Title
Photothermal examination of adhesion in semiconductor devices
Author
Suszynski, Z.
Author_Institution
Tech. Univ. of Koszalin
Volume
21
Issue
3
fYear
1998
fDate
9/1/1998 12:00:00 AM
Firstpage
434
Lastpage
440
Abstract
The adhesion quality influence on the phase and amplitude characteristics of the thermal transmittance in the layered structures is determined theoretically and experimentally. The photothermal pictures of ultrasonic bonds, the galvanized lead frame, and the semiconductor chips soldered to the lead frame are presented and discussed
Keywords
adhesion; photothermal effects; semiconductor device packaging; semiconductor device testing; soldering; adhesion; chip soldering; galvanized lead frame; layered structure; photothermal measurement; semiconductor device; thermal transmittance; thermal wave imaging; ultrasonic bonding; Acoustic measurements; Adhesives; Delamination; Galvanizing; Lead compounds; Optical modulation; Optical surface waves; Semiconductor devices; Temperature; Thermal conductivity;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher
ieee
ISSN
1070-9886
Type
jour
DOI
10.1109/95.725207
Filename
725207
Link To Document