Title :
Photothermal examination of adhesion in semiconductor devices
Author_Institution :
Tech. Univ. of Koszalin
fDate :
9/1/1998 12:00:00 AM
Abstract :
The adhesion quality influence on the phase and amplitude characteristics of the thermal transmittance in the layered structures is determined theoretically and experimentally. The photothermal pictures of ultrasonic bonds, the galvanized lead frame, and the semiconductor chips soldered to the lead frame are presented and discussed
Keywords :
adhesion; photothermal effects; semiconductor device packaging; semiconductor device testing; soldering; adhesion; chip soldering; galvanized lead frame; layered structure; photothermal measurement; semiconductor device; thermal transmittance; thermal wave imaging; ultrasonic bonding; Acoustic measurements; Adhesives; Delamination; Galvanizing; Lead compounds; Optical modulation; Optical surface waves; Semiconductor devices; Temperature; Thermal conductivity;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
