Title :
Development of large-area BaTi03 ceramics with optimized depletion regions as dielectrics for planar power electronics
Author :
Campbell, Colin K. ; Van Wyk, Jacobus Daniel ; Holm, Max Frederich Karl
Author_Institution :
McMaster Univ., Hamilton, Ont., Canada
fDate :
9/1/1998 12:00:00 AM
Abstract :
High-voltage (500 V) barium titanate (BaTiO3) ceramics are under development as compact high-permittivity dielectrics for planar structures in integrated power-electronic converters. Dielectric requirements include a high permittivity for meeting the dimensional constraints in converters, a high power-handling capability, low loss, and flat permittivity and tanδ frequency responses up to 1 MHz. Dopant materials examined here focused on fine powders of Al203 and Al added during the sintering process. Best results were obtained by diffusion of externally-placed Al during the sintering cycle, with BaTiO3 permittivities εr ~1000, and loss tangents tanδ <~4% over 1 kHz to 1 MHz. This paper describes fabrication and doping methods aimed at achieving such specifications. Electrical C-V testing up to 500 V on specimens of thickness 0.5-0.7 mm (with E-field intensities up to 106 V/m) was carried out using l-kHz bridge measurements, as well as in a power-electronic chopper circuit employing a BJT switch, and operating up to 500 V with pulse widths ~25 μs and repetition rates ~4 kHz
Keywords :
alumina; barium compounds; ceramics; choppers (circuits); dielectric losses; hybrid integrated circuits; power convertors; power integrated circuits; sintering; C-V testing; E-field intensities; bridge measurements; ceramics; chopper circuit; dimensional constraints; high-permittivity dielectrics; hybrid IC; integrated power-electronic converters; optimized depletion regions; planar power electronics; power-handling capability; sintering process; tanδ frequency responses; Barium; Ceramics; Circuit testing; Dielectric losses; Dielectric materials; Frequency conversion; Permittivity; Pulse measurements; Switches; Titanium compounds;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on