• DocumentCode
    1438738
  • Title

    Using atomic force microscopy for deep submicron failure analysis

  • Author

    Lo, Jien-Chung ; Armitage, William D. ; Johnson, Corbet S., III

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Rhode Island Univ., Kingston, RI, USA
  • Volume
    18
  • Issue
    1
  • fYear
    2001
  • Firstpage
    10
  • Lastpage
    18
  • Abstract
    As circuit feature size continues to shrink, we will soon need a failure analysis technique that provides resolutions of 10 nanometers or less. This feasibility study concludes that AFM technology, with reasonable improvements, can take over where focused ion beams leave off
  • Keywords
    VLSI; atomic force microscopy; circuit testing; failure analysis; AFM technology; atomic force microscopy; deep submicron failure analysis; Atomic force microscopy; Atomic layer deposition; Circuits; Educational institutions; Electron beams; Failure analysis; Focusing; Image resolution; Ion beams; Probes;
  • fLanguage
    English
  • Journal_Title
    Design & Test of Computers, IEEE
  • Publisher
    ieee
  • ISSN
    0740-7475
  • Type

    jour

  • DOI
    10.1109/54.902818
  • Filename
    902818
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1438738