DocumentCode :
1438738
Title :
Using atomic force microscopy for deep submicron failure analysis
Author :
Lo, Jien-Chung ; Armitage, William D. ; Johnson, Corbet S., III
Author_Institution :
Dept. of Electr. & Comput. Eng., Rhode Island Univ., Kingston, RI, USA
Volume :
18
Issue :
1
fYear :
2001
Firstpage :
10
Lastpage :
18
Abstract :
As circuit feature size continues to shrink, we will soon need a failure analysis technique that provides resolutions of 10 nanometers or less. This feasibility study concludes that AFM technology, with reasonable improvements, can take over where focused ion beams leave off
Keywords :
VLSI; atomic force microscopy; circuit testing; failure analysis; AFM technology; atomic force microscopy; deep submicron failure analysis; Atomic force microscopy; Atomic layer deposition; Circuits; Educational institutions; Electron beams; Failure analysis; Focusing; Image resolution; Ion beams; Probes;
fLanguage :
English
Journal_Title :
Design & Test of Computers, IEEE
Publisher :
ieee
ISSN :
0740-7475
Type :
jour
DOI :
10.1109/54.902818
Filename :
902818
Link To Document :
بازگشت