DocumentCode
1438872
Title
Nonsilicide source/drain pixel for 0.25-μm CMOS image sensor
Author
Dun-Nian Yaung ; Shou-Gwo Wuu ; Yean-Kuen Fang ; Wang, C.S. ; Chien-Hsien Tseng ; Mon-Song Lian
Author_Institution
Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Volume
22
Issue
2
fYear
2001
Firstpage
71
Lastpage
73
Abstract
A nonsilicide source/drain pixel is proposed for high performance 0.25-μm CMOS image sensor. By using organic material spin coat and etch back, silicide is only formed on poly gate which can be used as interconnection, not for source/drain region that solve the optical opaqueness and undesirably large junction leakage of silicide. The performance of MOSFET changes little due to the high sheet resistance of nonsilicide source/drain. With H2 annealing and double ion implanted source/drain junction, the dark current can be further reduced. The novel pixel (three transistors, 3.3 μm×3.3 μm, fill factor: 28%) shows low dark current (less than 0.5 fA per pixel at 25/spl deg/C) and high photoresponse.
Keywords
CMOS image sensors; annealing; dark conductivity; ion implantation; isolation technology; leakage currents; 0.25 micron; 3.3 micron; CMOS image sensor; annealing; dark current; double ion implanted source/drain junction; fill factor; interconnection; junction leakage; nonsilicide source/drain pixel; organic material spin coat; photoresponse; sheet resistance; CMOS image sensors; Dark current; Etching; MOSFET circuits; Optical interconnections; Optical sensors; Organic materials; Particle beam optics; Pixel; Silicides;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/55.902835
Filename
902835
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