• DocumentCode
    1439581
  • Title

    Plumbing the Depths of the Nanometer Scale

  • Author

    Dong, Lixin ; Tao, Xinyong ; Zhang, Li ; Zhang, Xiaobin ; Nelson, Bradley J.

  • Author_Institution
    Xi´´an Univ. of Technol. (XUT), China
  • Volume
    4
  • Issue
    1
  • fYear
    2010
  • fDate
    3/1/2010 12:00:00 AM
  • Firstpage
    13
  • Lastpage
    22
  • Abstract
    Nanometer-scale plumbing systems that can transport attograms of material are no longer a pipe dream. Carbon nanotubes (CNTs), with their extremely strong mechanical strength and nanometer-sized hollow cores, are ideal candidates for nanochannels. Experimental setup for investigating the mechanisms of mass delivery is demonstrated in this article. Two Cu-filled CNTs supported on a sample holder and a probe provide three different cases to investigate subjected to electric current, thermal transport, charges, and ionization. Shown here are the schematic of nanorobotic spot welding, time-resolved TEM images from video frames showing the flowing process. The copper core started to flow inside the carbon shells from the root to the tip as the bias voltage reaches up to 2.5 V. Also shown is the mass changes along with time. The mass flow rate is then drawn out from the fitting curve as approximately 120 ag/s. Correlation of the current density and the mass flow rate shows that the driven mechanism is electromigration. The mechanisms for filling and transport have been demonstrated and explained, but significant developments are required for complete system construction.
  • Keywords
    carbon nanotubes; copper; current density; electromigration; mass transfer; microchannel flow; nanofluidics; spot welding; transmission electron microscopy; C; Cu; Cu-filled CNT; attogram mass transport; bias voltage; carbon nanotubes; copper core; current density; electric current; electromigration; fitting curve; flowing process; mass delivery; mass flow rate; nanochannels; nanometer-scale plumbing; nanometer-sized hollow cores; nanorobotic spot welding; thermal transport; time-resolved TEM; Carbon nanotubes; Copper; Current density; Curve fitting; Electromigration; Filling; Ionization; Probes; Spot welding; Voltage;
  • fLanguage
    English
  • Journal_Title
    Nanotechnology Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    1932-4510
  • Type

    jour

  • DOI
    10.1109/MNANO.2010.935969
  • Filename
    5430564