DocumentCode :
1439927
Title :
SOI-Supported Microdevice for Hydrogen Purification Using Palladium–Silver Membranes
Author :
Deshpande, Kishori ; Meldon, Jerry H. ; Schmidt, Martin A. ; Jensen, Klavs F.
Author_Institution :
Dow Chem. Co., Freeport, TX, USA
Volume :
19
Issue :
2
fYear :
2010
fDate :
4/1/2010 12:00:00 AM
Firstpage :
402
Lastpage :
409
Abstract :
High-purity hydrogen continues to receive attention as a promising energy source for fuel cells in portable power applications. On-demand hydrogen generation via fuel reforming offers a convenient alternative to hydrogen storage, but the concomitant CO generation is deleterious to the fuel cell catalyst. Of the possible hydrogen purification options, palladium membranes allow a compact design suitable for portable applications. We present a micromembrane device built in silicon-on-insulator wafers for hydrogen purification. The design imparts structural stability to a submicrometer-thick palladium-silver membrane, enabling hydrogen purification at higher pressures than were tolerated by previous devices with supported thin palladium membranes. The devices are manufactured using bulk micromachining techniques including photolithography, plasma, and wet etching. They are operated at pressures up to 2 atm with a correspondingly enhanced hydrogen flux. In particular, thin (200 nm) palladium-silver membrane yield high permeation rates of up to 50 mol/m2/s at 350??C . The different transport resistances controlling hydrogen permeation in the micromembrane system are evaluated.
Keywords :
fuel cells; micromachining; palladium; photolithography; purification; silicon-on-insulator; silver; sputter etching; SOI; bulk micromachining; fuel cells; fuel reforming; hydrogen generation; hydrogen purification; microdevice; micromembrane device; palladium-silver membranes; photolithography; plasma etching; portable power applications; silicon-on-insulator wafers; structural stability; wet etching; Hydrogen; micromachining; palladium alloys; silicon-on-insulator (SOI) technology;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2010.2041529
Filename :
5430871
Link To Document :
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