• DocumentCode
    1439941
  • Title

    The Soft \\hbox {Punchthrough}+ Superjunction Insulated Gate Bipolar Transistor: A High Speed Structure With Enhanced Electron Injection

  • Author

    Antoniou, Marina ; Udrea, Florin ; Bauer, Friedhelm ; Nistor, Iulian

  • Author_Institution
    Electr. Eng. Dept., Univ. of Cambridge, Cambridge, UK
  • Volume
    58
  • Issue
    3
  • fYear
    2011
  • fDate
    3/1/2011 12:00:00 AM
  • Firstpage
    769
  • Lastpage
    775
  • Abstract
    The aim of this paper is to demonstrate the application of the superjunction (SJ) design in an insulated gate bipolar transistor (IGBT). Bipolar conduction is present and enhanced at the cathode side of the device, while the p-pillars collect the plasma deep from the anode side, thus significantly enhancing its turn-off speed. The disconnected soft punchthrough + (SPT+) SJ IGBT is similar to the SJ IGBT, which we have previously reported, but the drift region pillars do not extend up to the cathode contact. Instead, the upper part of this device is similar to the SPT+ IGBT, i.e., it features an n+ injector around the p-well and the n-drift region that is lightly doped. The improvement in the overall performance is impressive (25% lower ON-state losses and 30% lower switching losses) and can indeed justify the technology cost associated with the SJ technology. We also demonstrate how this technology can be used to form a snapback-free reverse conducting IGBT.
  • Keywords
    insulated gate bipolar transistors; p-n junctions; IGBT; bipolar conduction; electron injection; insulated gate bipolar transistor; n-drift region; p-well region; soft punchthrough; superjunction design; Anodes; Cathodes; Doping; Insulated gate bipolar transistors; Junctions; Performance evaluation; Switches; Insulated gate bipolar transistor (IGBT); reverse conducting (RC) insulated gate bipolar transistor (IGBT); soft punchthrough; superjunction (SJ);
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2010.2101076
  • Filename
    5705568