• DocumentCode
    1440094
  • Title

    Capacitance Measurements of Two-Dimensional and Three-Dimensional IC Interconnect Structures by Quasi-Static C – $C$–$V$ (QSCV); through-silicon via (TSV);

  • fLanguage
    English
  • Journal_Title
    Instrumentation and Measurement, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9456
  • Type

    jour

  • DOI
    10.1109/TIM.2011.2179829
  • Filename
    6145676