• DocumentCode
    1440791
  • Title

    Structural Feature-Based Fault-Detection Approach for the Recipes of Similar Products

  • Author

    Ko, Jong Myoung ; Kim, Chang Ouk ; Lee, Seung Jun ; Hong, Joo Pyo

  • Author_Institution
    Dept. of Inf. & Ind. Eng., Yonsei Univ., Seoul, South Korea
  • Volume
    23
  • Issue
    2
  • fYear
    2010
  • fDate
    5/1/2010 12:00:00 AM
  • Firstpage
    273
  • Lastpage
    283
  • Abstract
    The sensor signals (i.e., data streams of process parameters) of semiconductor processes exhibit nonlinear, multimodal trajectories with some common structural features. In this paper, we propose a process fault-detection approach based on the structural features of the sensor signals, such as the geometric shape, length, and height. The approach aims at constructing a shared univariate model and a multivariate model. The shared univariate model is set up for individual process parameters and clusters the process recipes of similar products. The result is a tree where the leaf nodes and intermediate nodes correspond to individual recipes and feature-based fault-detection criteria, respectively. The recipes with the same parent nodes share the criteria specified in the nodes. On the other hand, the multivariate model is constructed for a process recipe. It builds a Hotelling´s T 2 that considers the correlations between the signal structures of the process parameters. We demonstrated that the test results of the two models using the data collected from a work-site etch process were encouraging.
  • Keywords
    automatic testing; fault diagnosis; integrated circuit testing; semiconductor device manufacture; sensors; data streams; feature based fault detection criteria; geometric shape; multivariate model; process fault detection; process parameters; semiconductor processes; sensor signals; shared univariate model; structural feature based fault detection; Feature-based fault-detection criteria; multivariate model; process fault detection; semiconductor manufacturing; shared univariate model;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/TSM.2010.2045587
  • Filename
    5431000