DocumentCode :
1441159
Title :
Modeling of Retention Failure Behavior in Bipolar Oxide-Based Resistive Switching Memory
Author :
Bin Gao ; Zhang, Haowei ; Chen, Bing ; Liu, Lifeng ; Liu, Xiaoyan ; Han, Ruqi ; Kang, Jinfeng ; Fang, Zheng ; Yu, Hongyu ; Bin Yu ; Kwong, Dim-Lee
Author_Institution :
Key Lab. of Microelectron. Devices & Circuits, Peking Univ., Beijing, China
Volume :
32
Issue :
3
fYear :
2011
fDate :
3/1/2011 12:00:00 AM
Firstpage :
276
Lastpage :
278
Abstract :
The retention failure of bipolar oxide-based resistive switching memory is investigated. A new physical model is proposed to elucidate the typical retention failure behavior of the oxide-based resistive switching memory with a sudden resistance transition, which is quite different from that of the traditional memories. In the new proposed model, the temperature- and bias-dependent failure probability and failure time of the devices can be quantified. A temperature- and voltage-acceleration method is developed to evaluate the retention of resistive switching memories.
Keywords :
integrated circuit modelling; random-access storage; bias-dependent failure probability; bipolar oxide-based resistive switching memory; failure time; nonvolatile storage; resistance transition; retention failure; temperature-acceleration; temperature-dependent failure probability; voltage-acceleration; Electrical resistance measurement; Resistance; Stress measurement; Switches; Temperature measurement; Time measurement; Voltage measurement; Hafnium oxide; nonvolatile memory; resistive random access memory (RRAM); resistive switching; retention;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2010.2102002
Filename :
5706342
Link To Document :
بازگشت