DocumentCode
1441746
Title
Robust Superhydrophobic Surfaces Prepared With Epoxy Resin and Silica Nanoparticles
Author
Xiu, Yonghao ; Liu, Yan ; Balu, Balamurali ; Hess, Dennis W. ; Wong, Chingping
Volume
2
Issue
3
fYear
2012
fDate
3/1/2012 12:00:00 AM
Firstpage
395
Lastpage
401
Abstract
When nanoparticles are incorporated into surfaces to generate roughness, adhesion of the particles is critical to achieve a durable superhydrophobic surface. In this investigation, we explored the use of bis-phenol A based epoxy and silica nanoparticles to form a composite layer on substrates. After an plasma treatment of the surface layer, the epoxy was etched away and silica nanoparticles exposed on the surface, thereby generating roughness. The plasma etching time was examined to correlate the resulting surface morphology and water droplet contact angles after a fluoroalkyl silane treatment. Surface mechanical stability was studied by an abrasion test. Water vapor condensation on the surface was also assessed by investigation of the contact angle, which offers insight into the applicability of the surfaces to use under hot and humid conditions where degradation of the superhydrophobic surfaces may occur.
Keywords
abrasion; adhesion; condensation; contact angle; filled polymers; hydrophobicity; mechanical stability; nanocomposites; nanofabrication; nanoparticles; plasma materials processing; resins; silicon compounds; sputter etching; surface morphology; surface roughness; surface treatment; wear testing; SiO2; abrasion testing; adhesion; bisphenol A based epoxy resin; composite layer; fluoroalkyl silane treatment; oxygen plasma treatment; plasma etching; silica nanoparticles; superhydrophobic surface; surface mechanical stability; surface morphology; surface roughness; surface treatment; water droplet contact angle; water vapor condensation; Etching; Hysteresis; Plasmas; Rough surfaces; Surface morphology; Surface roughness; Mechanical robustness; silica nanocomposites; superhydrophobicity;
fLanguage
English
Journal_Title
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
2156-3950
Type
jour
DOI
10.1109/TCPMT.2011.2177088
Filename
6146414
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