DocumentCode :
1444437
Title :
Selective negative word line scheme for improving refresh
Author :
Lee, M.J. ; Park, K.W. ; Ahn, J.H.
Author_Institution :
R&D Div., Hynix Semicond. Inc., Icheon, South Korea
Volume :
47
Issue :
3
fYear :
2011
Firstpage :
168
Lastpage :
169
Abstract :
Proposed is a new selective negative word line scheme that yields almost 2.7% of the fail bit count (FBC) in a DRAM chip with a conventional negative word line scheme in the pause refresh state. It has a superior dynamic refresh characteristic, which is almost 0.3% of the FBC in a DRAM chip using the ground word line scheme. This scheme leads to a very low cell VTH (threshold voltage).
Keywords :
DRAM chips; DRAM chip; dynamic refresh characteristic; fail bit count; ground word line scheme; pause refresh state; selective negative word line scheme;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el.2010.3643
Filename :
5710047
Link To Document :
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