DocumentCode :
1444466
Title :
The influence of mechanical factors on electrical treeing
Author :
Varlow, B.R. ; Auckland, D.W.
Author_Institution :
Div. of Electr. Eng., Manchester Univ., UK
Volume :
5
Issue :
5
fYear :
1998
fDate :
10/1/1998 12:00:00 AM
Firstpage :
761
Lastpage :
766
Abstract :
Emphasis is placed on the growing body of evidence demonstrating the importance of mechanical factors in the initiation and growth of electrical trees in solid polymeric insulating materials. Specimens using point-plane electrode geometries in homogeneous resins, with and without barrier inserts, have been investigated. The authors draw particular attention to the importance of the adhesive bond between component parts in composite insulation and the effect that this has on the internal mechanical stress. The effects of elevated temperatures and the absorption of moisture on both the mechanical and electrical characteristics of these specimens provide additional correlations between treeing and mechanical properties
Keywords :
adhesion; composite insulating materials; internal stresses; moisture; organic insulating materials; polymers; trees (electrical); adhesive bond; barrier insert; composite insulation; electrical treeing; elevated temperature; homogeneous resin; internal mechanical stress; moisture absorption; point-plane electrode; solid polymeric insulating material; Bonding; Dielectrics and electrical insulation; Electrodes; Geometry; Mechanical factors; Plastic insulation; Polymers; Resins; Solids; Trees - insulation;
fLanguage :
English
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9878
Type :
jour
DOI :
10.1109/94.729700
Filename :
729700
Link To Document :
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