DocumentCode :
1444520
Title :
Equipotential shells for efficient inductance extraction
Author :
Beattie, Michael ; Krauter, Byron ; Alatan, Lale ; Pileggi, Lawrence
Author_Institution :
Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
Volume :
20
Issue :
1
fYear :
2001
fDate :
1/1/2001 12:00:00 AM
Firstpage :
70
Lastpage :
79
Abstract :
To make three-dimensional (3-D) on-chip interconnect inductance extraction tractable, it is necessary to ignore parasitic couplings without compromising critical properties of the interconnect system. It is demonstrated that simply discarding faraway mutual inductance couplings can lead to an unstable approximate inductance matrix. In this paper, we describe an equipotential shell methodology, which generates a partial inductance matrix that is sparse yet stable and symmetric. We prove the positive definiteness of the resulting approximate inductance matrix when the equipotential shells are properly defined. Importantly, the equipotential shell approach also provably preserves the inductance of loops if they are enclosed entirely within the shells of their segments. Methods for sizing the shells to control the accuracy are presented. To demonstrate the overall efficacy for on-chip extraction, ellipsoid shells, which are a special case of the general equipotential shell approach, are presented and demonstrated for both on-chip and system-level extraction examples
Keywords :
circuit CAD; inductance; integrated circuit design; integrated circuit interconnections; integrated circuit modelling; 3D on-chip interconnect; ellipsoid shells; equipotential shells; inductance extraction; parasitic couplings; partial inductance matrix; positive definiteness; system-level extraction; Capacitance; Coupling circuits; Eigenvalues and eigenfunctions; Inductance; Integrated circuit interconnections; Integrated circuit modeling; Mutual coupling; Sparse matrices; Symmetric matrices; System-on-a-chip;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/43.905676
Filename :
905676
Link To Document :
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