• DocumentCode
    1444741
  • Title

    Critical issues in plasma-assisted vapor deposition processes

  • Author

    Bunshah, Rointan F.

  • Author_Institution
    Dept. of Mater. Sci. & Eng., California Univ., Los Angeles, CA, USA
  • Volume
    18
  • Issue
    6
  • fYear
    1990
  • fDate
    12/1/1990 12:00:00 AM
  • Firstpage
    846
  • Lastpage
    854
  • Abstract
    The currently used plasma-assisted vapor deposition processes are reviewed. They are analyzed in terms of the three steps in deposition processes, i.e. generation of the depositing species, transport from source to substrate, and film growth on the substrate. The role of the plasma in each of the steps for the various processes is discussed. All processes involve two sets of parameters: the plasma parameters and the process parameters. These parameters couple to a greater or lesser degree in each of the basic processes, which reflects their versatility. The roles of plasma volume chemistry and plasma diagnostics are discussed. It is clear that a deeper basic understanding of plasma-assisted deposition processes necessitates a much greater volume of work on plasma diagnostics coupled with theoretical estimates. The influence of ion bombardment on the structure, composition, and properties of the films is considered. Hybrid processes which attempt to circumvent the somewhat deleterious intercoupling of the plasma and process parameters are briefly discussed
  • Keywords
    plasma deposition; reviews; film growth; ion bombardment; plasma diagnostics; plasma volume chemistry; plasma-assisted vapor deposition; Atherosclerosis; Chemical vapor deposition; Plasma applications; Plasma chemistry; Plasma diagnostics; Plasma sources; Plasma transport processes; Sputtering; Substrates; Thermal spraying;
  • fLanguage
    English
  • Journal_Title
    Plasma Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0093-3813
  • Type

    jour

  • DOI
    10.1109/27.61495
  • Filename
    61495