Author :
Bolouri, H. ; Laforge, L.E.
Abstract :
Presents the front cover for this issue of the publication.
Keywords :
Application software; Components, packaging, and manufacturing technology; Microelectronics; Micromechanical devices; Monitoring; Packaging; Pulp manufacturing; Silicon; Switches; Testing;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TCPMB.1998.730411
