DocumentCode :
1445587
Title :
Inside front cover
Author :
Kolesar, Edward S., Jr. ; Reston, Rocky R.
Author_Institution :
Dept. of Eng., Texas Christian Univ., Fort Worth, TX, USA
Volume :
21
Issue :
4
fYear :
1998
Abstract :
A miniature gas chromatography (GC) system has been designed and fabricated using silicon micromachining and integrated circuit (IC) processing techniques. The silicon micromachined gas chromatography system (SMGCS) is composed of a miniature sample injector that incorporates a 10 /spl mu/I sample loop; a 0.9-m long, rectangular-shaped (300 /spl mu/m width and 10 /spl mu/m height) capillary column coated with a 0,2-/spl mu/m thick copper phthalocyanine (CuPc) stationary-phase; and a dual-detector scheme based upon a CuPc-coated chemiresistor and a commercially available, 125-/spl mu/m diameter thermal conductivity detector (TCD) bead. Silicon micromachining was employed to fabricate the interface between the sample injector and the GC column, the column itself, and the dual-detector cavity. A novel IC thin-film processing technique was developed to sublime the CuPc stationary-phase coating on the column walls that were micromachined in the host silicon wafer substrate and Pyrex cover plate, which were then electrostatically bonded together. The SMGCS can separate binary gas mixtures composed of parts-per-million (ppm) concentrations of ammonia (NH/sub 3/) and nitrogen dioxide (NO/sub 2/) when isothermally operated (55-80/spl deg/C). With a helium carrier gas and nitrogen diluent, a 10 /spl mu/I sample volume containing ammonia and nitrogen dioxide injected at 40 psi (2.8 /spl times/105 Pa) ran be separated in less than 30 min.
Keywords :
chromatography; elemental semiconductors; micromachining; silicon; 40 psi; 55 to 80 C; NH/sub 3/; NO/sub 2/; SMGCS; Si; binary gas mixture separation; capillary column; chemiresistor; copper phthalocyanine stationary phase coating; dual detector; electrostatic bonding; integrated circuit thin film processing; miniature gas chromatography system; sample injector; silicon micromachining; thermal conductivity detector bead; Coatings; Copper; Detectors; Gas chromatography; Micromachining; Nitrogen; Semiconductor thin films; Silicon; Substrates; Thermal conductivity;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9894
Type :
jour
DOI :
10.1109/96.730412
Filename :
730412
Link To Document :
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