Title :
Foreword: Microelectronics system integration
Author :
Bolouri, Hamid ; Laforge, Laurence E.
Author_Institution :
Guest Editor University of Hertfordshire Hertfordshire, U.K.
Abstract :
IT IS A delight and honor to introduce this special issue of the IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY — PART B: ADVANCED PACKAGING. We feature six works, each of which was presented at ISIS´97, the 1997 IEEE International Conference on Innovative Systems in Silicon. As a showcase for microelectronics systems integration, the conference spans the spectrum from submicron device technology, through design techniques, and computer aided design, to systems architecture. The papers in this issue represent a peer-reviewed consensus of conference highlights, and reflect contemporary trends in applications, miniaturization, testing, and economics. Four of the contributions exemplify how to conceive, design, and implement a silicon system. The other two focus on effective application of technology and engineering resources in evaluating silicon systems.
Keywords :
B-ISDN; VLSI; asynchronous transfer mode; buffer circuits; fault tolerance; integrated circuit design; integrated circuit interconnections; integrated circuit yield; quality of service; redundancy; telecommunication network routing; 3-D implementation; ATM switch; adjacent nodes; basic modules; buffer design; cell routing function; crossbar switches; defect tolerance; hardware implementation; hierarchical interconnection; interconnection topology; modular architecture; modular growth; queueing; stacked VLSI; topology; Asynchronous transfer mode; Bit rate; Communication switching; Hardware; Quality of service; Routing; Switches; Telecommunication traffic; Topology; Very large scale integration;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
