Title :
Polymeric conductive pastes as solder replacement for flip-chip attachment
Author :
Maner, Kaoru U. ; Ang, Simon S. ; Schaper, Leonard W. ; Brown, William D.
Author_Institution :
University of Arkansas, Fayetteville, AR 72701 USA
Abstract :
The fabrication and characterization of flip-chip assemblies using four polymeric conductive pastes as attachment materials are reported. Three thermoset and one thermoplastic polymeric conductive pastes were investigated. Polymeric conductive pastes having silver particles 2 μm in size made good contact to either smooth or rough metal. Electrical contact with pastes whose particles were 5 μm or larger could only be obtained on rough metal.
Keywords :
cracks; delamination; encapsulation; integrated circuit design; integrated circuit packaging; integrated circuit reliability; large scale integration; microassembling; plastic packaging; stress analysis; thermal stresses; LSI plastic packages; delaminations; design parameters; die-bonding materials; encapsulant resin; leadframe packages; numerical stress analysis; package design guide; package geometry factors; resin cracking; temperature cyclic loading; Conducting materials; Copper alloys; Delamination; Geometry; Large scale integration; Lead; Plastic packaging; Resins; Stress; Temperature; Flip-chip; polymeric conductive pastes; thermoplastic; thermoset;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
