Title :
Linear fracture mechanics analysis on growth of interfacial delamination in lsi plastic packages under temperature cyclic loading
Author :
Saitoh, Takehiro ; Matsuyama, Hidehito ; Toya, Masayuki
Author_Institution :
NEC Corporation, Kanagawa 229, Japan
Abstract :
A study is made of the tendency of growth of delamination between dissimilar materials occurring in large scale integration (LSI) plastic packages under temperature cyclic loading. Two groups of delamination growth processes are considered; one along the interface between the top surface of the die pad and the die-bonding layer, and the other along the interface between the bottom surface of the die pad and the encapsulant resin. In each group several different initial patterns of delaminations are assumed. Stress intensity factors and their mode ratios at the tips of growing delaminations are calculated by combining a thermoelastic finite element method for nonlinear contact problems and a linear interface fracture mechanics approach. The effects of geometries of delamination and leadframe materials on the tendency of delamination growth are clarified.
Keywords :
S-parameters; dielectric loss measurement; microwave measurement; network analysers; permittivity measurement; strip lines; two-port networks; Teflon; characteristic impedance; composite laminate; dielectric constant measurement; dielectric loss tangent measurement; dielectric material; insertion loss; insulation material; integrated circuit molding compound; return loss; stripline transmission line; two-port scattering parameters; vector network analyzer; Dielectric constant; Dielectric loss measurement; Dielectric losses; Dielectric materials; Dielectric measurements; Impedance; Insertion loss; Loss measurement; Stripline; Transmission line measurements; Coefficient of thermal expansion; LSI; Young´s modulus; delamination; die-bonding material; encapsulant resin; finite element method; fracture mechanics; leadframe; plastic package; stress intensity factor; temperature cyclic loading; thermal stress;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
