• DocumentCode
    1445733
  • Title

    Multidimensional VCSEL-array push/pull module fabricated using the self-alignment mounting technique

  • Author

    Kosaka, Hideo ; Kajita, Mikihiro ; Sugimoto, Yoshimasa

  • Author_Institution
    NEC Opto-Electronics Research Laboratories, Ibaraki 305, Japan
  • Volume
    21
  • Issue
    4
  • fYear
    1998
  • Firstpage
    471
  • Lastpage
    478
  • Abstract
    We have developed plastic-molded receptacle-lope vertical-cavity surface-emitting laser (VCSEL)-array modules directly push/pull connectable with the one-dimensional (1-D) conventional mechanically-transferable multifiber push-on (MPO) fiber connector and with a new two-dimensional (2-D) MPO-compatible fiber connector developed for this module. The VCSEL was mounted on the plastic-molded package using a highly precise completely alignment-free process using flip-chip solder bonding and ball-guide die bonding. These modules exhibit an optical coupling loss of 0.67 ± 0.23 dB (efficiency: 85.8 ± 2.93%) and a loss deviation of less than 0.26 dB for 100 matings with the fiber connector (MMF50). The modules were operated at a bit rate of 1 Gbps/ch without an isolator and showed floor-less bit error rate (BER) performance at temperatures up to 70 °C. At 1 Gbps/ch their optical sensitivity at a BER of 10−11 was −26.0 dBm ± 0.9 dB. These structures and techniques are applicable to high-density, high-throughput optical parallel interconnections and optical space-division switches.
  • Keywords
    Optical fiber coupling; optical interconnections; parallel processing; plastic packaging; semiconductor device packaging; semiconductor laser arrays; surface mounting; surface-emitting lasers;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9894
  • Type

    jour

  • DOI
    10.1109/TCPMB.1998.730433
  • Filename
    730433