• DocumentCode
    1445746
  • Title

    Optimal Terminations for Crosstalk Mitigation of High-Speed Interconnects With Discontinuities Using Modal Signaling

  • Author

    Milosevic, Pavle ; Beyene, Wendemagegnehu T. ; Schutt-Ainé, José E.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
  • Volume
    2
  • Issue
    5
  • fYear
    2012
  • fDate
    5/1/2012 12:00:00 AM
  • Firstpage
    860
  • Lastpage
    867
  • Abstract
    In high-speed chip-to-chip single-ended signaling links, far-end crosstalk presents one of the dominant noise sources, limiting the link performance. Diagonalizing the channel using modal decomposition has been proposed to mitigate the crosstalk. However, special attention needs to be devoted to the frequency dependence of optimal modal matching terminations used in modal signaling. In this paper, application of modal decomposition to a typical memory bus with discontinuities is presented. The properties of the modes are closely studied to construct the frequency-dependent optimum terminations, which are then synthesized using low-order passive RLC networks. The proposed approach is verified using statistical link simulation.
  • Keywords
    RLC circuits; crosstalk; integrated circuit interconnections; integrated circuit noise; chip-to-chip single-ended signaling link; crosstalk mitigation; dominant noise source; far-end crosstalk; frequency-dependent optimum termination; high-speed interconnect; link performance limitation; low-order passive RLC network; memory bus; modal decomposition; modal signaling; optimal modal matching termination; optimal termination; statistical link simulation; Admittance; Approximation methods; Crosstalk; Decoding; Matrix decomposition; Resonant frequency; Transmission line matrix methods; Crosstalk mitigation; RLC network synthesis; modal decomposition; multiconductor transmission lines;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2012.2185236
  • Filename
    6151074