DocumentCode
1446118
Title
Gallium nitride based high power heterojunction field effect transistors: process development and present status at UCSB
Author
Keller, Stacia ; Wu, Yi-Feng ; Parish, Giacinta ; Ziang, Naiqian ; Xu, Jane J. ; Keller, Bernd P. ; DenBaars, Steven P. ; Mishra, Umesh K.
Author_Institution
Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
Volume
48
Issue
3
fYear
2001
fDate
3/1/2001 12:00:00 AM
Firstpage
552
Lastpage
559
Abstract
The development of GaN based devices for microwave power electronics at the University of California, Santa Barbara (UCSB), is reviewed. From 1995 to 2000, the power performance of AlGaN/GaN-on-sapphire heterojunction field effect transistors improved from 1.1 W/mm to 6.6 W/mm, respectively. Compensating the disadvantages of the low thermal conductivity of the sapphire substrate through heat management via flip chip bonding onto AlN substrates, large periphery devices with an output power of 7.6 W were demonstrated. UCSB also fabricated the first GaN based amplifier integrated circuits. Critical issues involved in the growth of high quality AlGaN/GaN heterostructures by metal-organic chemical vapor deposition and the device fabrication are discussed
Keywords
III-V semiconductors; flip-chip devices; gallium compounds; microwave field effect transistors; microwave power transistors; power HEMT; semiconductor device packaging; substrates; thermal management (packaging); vapour phase epitaxial growth; wide band gap semiconductors; 7.6 W; Al2O3; AlGaN-GaN; AlGaN/GaN-on-sapphire devices; AlN substrates; GaN based high power HFETs; device fabrication; flip chip bonding; heat management; heterojunction field effect transistors; high power heterojunction FETs; high quality heterostructure growth; large periphery devices; low thermal conductivity substrate; metal-organic CVD; metal-organic chemical vapor deposition; microwave power HEMTs; microwave power electronics; power MODFETs; power performance; process development; sapphire substrate; Aluminum gallium nitride; Electromagnetic heating; FETs; Gallium nitride; Heterojunctions; III-V semiconductor materials; Microwave devices; Power electronics; Thermal conductivity; Thermal management of electronics;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.906450
Filename
906450
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