Title :
Power-Efficient High-Speed and High-Resolution Capacitive-Sensor Interface for Subnanometer Displacement Measurements
Author :
Xia, Sha ; Nihtianov, Stoyan
Author_Institution :
Delft Univ. of Technol., Delft, Netherlands
fDate :
5/1/2012 12:00:00 AM
Abstract :
This paper presents a power-efficient capacitive-sensor interface solution for high-speed and high-resolution subnanometer displacement measurement systems. The proposed solution utilizes a zoom-in capacitance-to-voltage converter stage to remove the offset posed by the large nominal sensor capacitance, which would otherwise dominate the dynamic range. The realized zoom-in factor is 100. The designed circuit uses a correlated-double-sampling technique to cancel both the amplifier offset and the reset noise. First, a printed-circuit-board solution was realized to verify the principle of operation and its limitations. Then, an integrated circuit was designed, fabricated, and tested. Measurement results show that the achievable capacitance resolution is better than 30 aF, from a sensor with a nominal capacitance of 10 pF, which translates into a dynamic range of 18 b. The measurement latency is only 5 μs. This performance is achieved with only 2.4-mW power consumption.
Keywords :
capacitive sensors; displacement measurement; integrated circuit design; integrated circuit testing; power convertors; printed circuits; amplifier offset cancellation; capacitance 10 pF; capacitance resolution; correlated-double-sampling technique; integrated circuit design; integrated circuit fabrication; integrated circuit testing; nominal sensor capacitance; power 2.4 mW; power-efficient high-speed high-resolution capacitive-sensor interface; printed-circuit-board solution; subnanometer displacement measurement system; time 5 mus; zoom-in capacitance-to-voltage converter stage; Capacitance; Capacitance measurement; Capacitive sensors; Capacitors; Displacement measurement; Noise; Switches; Capacitive sensor; displacement measurement; sensor interface;
Journal_Title :
Instrumentation and Measurement, IEEE Transactions on
DOI :
10.1109/TIM.2011.2178678