DocumentCode :
1446192
Title :
Multi-Chip Module Packaging For W-Band 
Modulator
Author :
Shireen, Rownak ; Shi, Shouyuan ; Yao, Peng ; Prather, Dennis W.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Delaware, Newark, DE, USA
Volume :
21
Issue :
3
fYear :
2011
fDate :
3/1/2011 12:00:00 AM
Firstpage :
145
Lastpage :
147
Abstract :
This letter presents ribbon bond transition of coplanar waveguides (CPWs) between two largely different dielectric constant materials, lithium niobate (LiNbO3) and alumina (Al2O3). The design plays an important role in multi-chip module (MCM) integrations of optoelectronic devices on LiNbO3 for the applications of millimeter-wave to optical signal processing. The impacts of ribbon bond parameters and CPW dimensions on the transmission characteristics are investigated over 100 GHz bandwidth. Simulated results are confirmed by measurements of the fabricated device.
Keywords :
alumina; coplanar waveguides; dielectric materials; lithium compounds; modulators; multichip modules; niobium compounds; optoelectronic devices; permittivity; Al2O3; CPW; LiNbO3; MCM; W-band modulator; coplanar waveguides; dielectric constant material; millimeter-wave; multichip module packaging; optical signal processing; optoelectronic device; ribbon bond transition; Bonding; Coplanar waveguides; Electrodes; Modulation; Optical waveguides; Substrates; Wire; ${rm LiNbO}_{3}$
fLanguage :
English
Journal_Title :
Microwave and Wireless Components Letters, IEEE
Publisher :
ieee
ISSN :
1531-1309
Type :
jour
DOI :
10.1109/LMWC.2010.2103375
Filename :
5710596
Link To Document :
