• DocumentCode
    144660
  • Title

    Investigation on the dynamic behaviors of paralleling T-type IGBT modules

  • Author

    Wu Yu ; Sun Yaojie ; Lin Yandan ; Zhang Junjun

  • Author_Institution
    Dept. of Illuminating & Light Sources, Fudan Univ., Shanghai, China
  • Volume
    2
  • fYear
    2014
  • fDate
    26-28 April 2014
  • Firstpage
    932
  • Lastpage
    938
  • Abstract
    The paralleling of three level T-type IGBT modules delivers unusual switching voltage and current. Influences of the temperature deviance on paralleling performance are analyzed in this paper. Turn-on behaviors of paralleling modules can be improved by certain temperature deviance. Turn-off behaviors are affected by temperature deviance in two ways, by both energy loss mismatch increases with temperature deviance. IGBT over voltage risk and di/dt risk show different trends. In addition, T-type IGBT modules have better paralleling performance as negative temperature coefficient of diode and positive temperature coefficient of IGBT compensate with each other when current flows into the neutral path. However unexpected current loop is formed when the paralleling T-type IGBT modules operated with temperature deviance. This paper provides guidance on hard circuit design of T-type IGBT modules paralleling applications.
  • Keywords
    insulated gate bipolar transistors; network synthesis; power semiconductor switches; semiconductor diodes; current flows; diode; dynamic behaviors; hard circuit design; neutral path; paralleling modules; temperature deviance; three level T-type IGBT modules; turn-on behaviors; unexpected current loop; unusual switching current; unusual switching voltage; voltage risk; Energy loss; Inductance; Insulated gate bipolar transistors; Junctions; Logic gates; Temperature measurement; Voltage measurement; IGBT; diode reverse recovery; paralleling; switching behaviors; temperature deviance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Information Science, Electronics and Electrical Engineering (ISEEE), 2014 International Conference on
  • Conference_Location
    Sapporo
  • Print_ISBN
    978-1-4799-3196-5
  • Type

    conf

  • DOI
    10.1109/InfoSEEE.2014.6947805
  • Filename
    6947805