DocumentCode
1446723
Title
Economic Analysis of the HOY Wireless Test Methodology
Author
Hsing, Yu-Tsao ; Denq, Li-Ming ; Chen, Chao-Hsun ; Wu, Cheng-Wen
Author_Institution
Nat. Tsing Hua Univ., Hsinchu, Taiwan
Volume
27
Issue
3
fYear
2010
Firstpage
20
Lastpage
30
Abstract
The HOY (Hypothesis, Odyssey, and Yield) test system provides wireless test access and embedded DFT, while offering lower cost and better performance than conventional ATE. This article briefly describes HOY, then proposes a test cost model to compare it with conventional ATE, and analyzes the test cost of these two methods for different manufacturing processes, area overheads, die sizes, manufacturing volumes, and test times.
Keywords
integrated circuit testing; semiconductor device manufacture; HOY wireless test methodology; area overheads; die sizes; economic analysis; manufacturing processes; manufacturing volumes; test cost model; test times; wireless test access; DFT; HOY; cost estimation; design and test; test cost model; wireless testing;
fLanguage
English
Journal_Title
Design & Test of Computers, IEEE
Publisher
ieee
ISSN
0740-7475
Type
jour
DOI
10.1109/MDT.2009.96
Filename
5255193
Link To Document