Microtechnology in the development of three-dimensional circuits

Author

Herrick, Katherine J. ; Yook, Jong-Gwan ; Katehi, Linda P B

Author_Institution

Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA

Volume

46

Issue

11

fYear

1998

fDate

11/1/1998 12:00:00 AM

Firstpage

1832

Lastpage

1844

Abstract

With today´s cost-conscience industry, low cost, high-performance, and high-profit microwave-circuit technologies are essential. To increase density and reduce size and cost, the integration of analog and digital circuits on one single chip is considered the most viable solution. In reducing the size of the overall system, high-density integration (HDI) and packaging have become critical components in circuit design. This paper reviews and evaluates state-of-the-art planar transmission lines and vertical interconnects for use in high-density multilayer circuits for silicon- and SiGe-based monolithic high-frequency circuits. Packaging issues associated with parasitics are discussed and examples of multilayer three-dimensional systems utilizing micromachining are presented

Keywords

Ge-Si alloys; MMIC; coplanar waveguides; integrated circuit interconnections; integrated circuit packaging; integrated circuit technology; micromachining; microstrip circuits; reviews; silicon; 3D circuits; Si; Si-based monolithic HF circuits; SiGe; SiGe-based monolithic HF circuits; high-density integration; high-density multilayer circuits; micromachining; microtechnology; microwave-circuit technologies; packaging; parasitics; planar transmission lines; three-dimensional circuits; vertical interconnects; Circuit synthesis; Costs; Frequency; Integrated circuit technology; Microstrip; Microwave circuits; Microwave technology; Packaging; Space technology; Space vehicles;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/22.734496

Filename

734496