DocumentCode
1448215
Title
Bipolar Integrated Circuits in 4H-SiC
Author
Singh, Shakti ; Cooper, James A.
Author_Institution
Birck Nanotechnol. Center, Purdue Univ., West Lafayette, IN, USA
Volume
58
Issue
4
fYear
2011
fDate
4/1/2011 12:00:00 AM
Firstpage
1084
Lastpage
1090
Abstract
Due to its wide band gap, 4H-SiC is potentially capable of sustained operation at temperatures well above 600 °C, but current devices are limited to lower temperatures by the stability of the metallization and passivation layers. SiC bipolar transistors are capable of operation at temperatures above 300 °C, as they do not have an oxide layer under high electric field and hence do not suffer from oxide reliability issues. In this paper, we describe bipolar digital integrated circuits on semi-insulating 4H-SiC that operate over a wide range of supply voltage and temperature, demonstrating the potential of SiC for high-temperature small-scale integrated-circuit applications.
Keywords
bipolar digital integrated circuits; bipolar transistor circuits; integrated circuit metallisation; integrated circuit reliability; passivation; power integrated circuits; silicon compounds; transistor-transistor logic; wide band gap semiconductors; SiC; bipolar digital integrated circuit; bipolar transistor; electric field; high-temperature small-scale integrated-circuit application; metallization layer; oxide layer; oxide reliability; passivation layer; Integrated circuit modeling; Inverters; Noise; Propagation delay; Silicon carbide; Temperature measurement; Transistors; High-temperature integrated circuits (ICs); SiC ICs; silicon carbide (SiC); smart power; transistor–transistor logic (TTL);
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2011.2107576
Filename
5711658
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