• DocumentCode
    1448215
  • Title

    Bipolar Integrated Circuits in 4H-SiC

  • Author

    Singh, Shakti ; Cooper, James A.

  • Author_Institution
    Birck Nanotechnol. Center, Purdue Univ., West Lafayette, IN, USA
  • Volume
    58
  • Issue
    4
  • fYear
    2011
  • fDate
    4/1/2011 12:00:00 AM
  • Firstpage
    1084
  • Lastpage
    1090
  • Abstract
    Due to its wide band gap, 4H-SiC is potentially capable of sustained operation at temperatures well above 600 °C, but current devices are limited to lower temperatures by the stability of the metallization and passivation layers. SiC bipolar transistors are capable of operation at temperatures above 300 °C, as they do not have an oxide layer under high electric field and hence do not suffer from oxide reliability issues. In this paper, we describe bipolar digital integrated circuits on semi-insulating 4H-SiC that operate over a wide range of supply voltage and temperature, demonstrating the potential of SiC for high-temperature small-scale integrated-circuit applications.
  • Keywords
    bipolar digital integrated circuits; bipolar transistor circuits; integrated circuit metallisation; integrated circuit reliability; passivation; power integrated circuits; silicon compounds; transistor-transistor logic; wide band gap semiconductors; SiC; bipolar digital integrated circuit; bipolar transistor; electric field; high-temperature small-scale integrated-circuit application; metallization layer; oxide layer; oxide reliability; passivation layer; Integrated circuit modeling; Inverters; Noise; Propagation delay; Silicon carbide; Temperature measurement; Transistors; High-temperature integrated circuits (ICs); SiC ICs; silicon carbide (SiC); smart power; transistor–transistor logic (TTL);
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2011.2107576
  • Filename
    5711658