DocumentCode
1449168
Title
Embedded I/O PAD Circuit Design for OTP Memory Power-Switch Functionality
Author
Shao-Chang Huang ; Ke-Horng Chen ; Wei-Yao Lin ; Zon-Lon Lee ; Kun-Wei Chang ; Hsu, Ethan ; Lee, Wei-Jen ; Lin-Fwu Chen ; Lu, Chao
Author_Institution
Inst. of Electr. & Control Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Volume
20
Issue
4
fYear
2012
fDate
4/1/2012 12:00:00 AM
Firstpage
746
Lastpage
750
Abstract
An additional high-voltage pad is generally applied for one-time-programming (OTP) memory product applications. This may increase the complexity of input/output (I/O) pad arrangement and the area penalty. In this paper, a novel approach of I/O circuit embedded with the power-switch function is proposed for multifunction integrations in one I/O pad. The capabilities of high-voltage programming, I/O signal handling, electrostatic discharge protection and latch-up prevention for this novel circuit are well examined from silicon verifications.
Keywords
electrostatic discharge; integrated circuit design; integrated memory circuits; I-O signal handling; OTP memory power-switch functionality; electrostatic discharge protection; embedded I-O PAD circuit design; high-voltage pad; high-voltage programming; input/output pad arrangement complexity; latch-up prevention; multifunction integrations; one-time-programming memory product applications; silicon verifications; Electrostatic discharge; Integrated circuits; Logic gates; MOSFETs; Programming; Stress; Testing; Electrostatic discharge (ESD); Neobit; one-time programming (OTP);
fLanguage
English
Journal_Title
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher
ieee
ISSN
1063-8210
Type
jour
DOI
10.1109/TVLSI.2011.2106808
Filename
5712201
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